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公开(公告)号：US20120098361A1
公开(公告)日：2012-04-26
申请号：US13379096
申请日：2010-06-23
IPC分类号： H02K9/00
CPC分类号： H02K11/0073 , B62D5/0406 , H02K5/225 , H02K11/33 , H02K2211/03
摘要： A heat sink has two heat radiation blocks. The heat radiation block is formed in a wide column shape. The heat radiation block has connection parts at both ends. The connection parts have respective holes formed to pass through in the axial direction of a motor. One screw is inserted in one connection part and threaded into a motor case. The other screw is inserted in the other connection part and threaded into the motor case together with a cover. A power module forming an inverter circuit of each of two power supply systems is arranged on each heat radiation blocks.
摘要翻译： 散热片有两个散热块。 散热块形成为宽的柱状。 散热块在两端具有连接部分。 连接部具有形成为沿电动机的轴向通过的各个孔。 一个螺丝插入一个连接部分并拧入电机外壳。 另一个螺钉插入另一个连接部分，并与盖子一起拧入电机外壳。 形成两个电源系统中的每一个的逆变器电路的功率模块布置在每个散热块上。
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公开(公告)号：US08338998B2
公开(公告)日：2012-12-25
申请号：US12822627
申请日：2010-06-24
CPC分类号： H02K9/22 , H01L23/36 , H01L25/11 , H01L2924/0002 , H02K11/33 , H01L2924/00
摘要： An electronic circuit including semiconductor modules and capacitors is positioned in the axial direction of a motor. Each semiconductor module is longitudinally positioned in contact with a heat sink. More specifically, a line perpendicular to the surface of a semiconductor chip included in the semiconductor module is perpendicular to the axis line of the motor. Consequently, each capacitor is positioned so that at least a part of the positional range of the capacitor in the axial direction of the motor coincides with the positional ranges of the semiconductor module and the heat sink in the axial direction.
摘要翻译： 包括半导体模块和电容器的电子电路位于电机的轴向。 每个半导体模块纵向定位成与散热器接触。 更具体地，垂直于包括在半导体模块中的半导体芯片的表面的线垂直于电动机的轴线。 因此，每个电容器被定位成使得电动机在电动机轴向上的位置范围的至少一部分与半导体模块和散热器在轴向方向上的位置范围一致。
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公开(公告)号：US20120098365A1
公开(公告)日：2012-04-26
申请号：US13380309
申请日：2010-06-23
IPC分类号： H02K11/00
CPC分类号： H02K9/22 , B62D5/0406 , H02K3/50 , H02K5/225 , H02K11/33
摘要： A heat sink of a drive apparatus includes a heat receiving surface located in a rising direction from an end surface wall of a motor case formed in an axial direction of the motor case. A power module includes a mold part and is arranged along the heat receiving surface of the heat sink. Motor leads are taken out from the motor case and electrically connected to the power module and winding wires. The drive apparatus has the motor case, a control circuit substrate, the heat sink, the power module and a power circuit substrate arranged in this order in the axial direction. The motor leads are connected to the power module at an opposite side of the motor case relative to the mold part in the axial direction.
摘要翻译： 驱动装置的散热器包括从沿电动机壳体的轴向方向形成的电动机壳体的端面壁沿上升方向设置的受热面。 功率模块包括模具部件并且沿着散热器的热接收表面布置。 电机引线从电机外壳中取出并与电源模块和绕组电线电连接。 驱动装置具有马达壳体，控制电路基板，散热器，电源模块和沿轴向依次布置的电源电路基板。 马达引线在轴向方向上相对于模具部件在马达壳体的相对侧连接到功率模块。
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公开(公告)号：US08710705B2
公开(公告)日：2014-04-29
申请号：US13336492
申请日：2011-12-23
IPC分类号： H02K9/00
CPC分类号： H02K11/0073 , B62D5/0406 , H02K3/50 , H02K5/225 , H02K9/22 , H02K11/33
摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).
摘要翻译： 包括半导体模块（501至506）和电容器（701至706）的电子控制单元（50,70）设置在电动机（30）的轴向上。 半导体模块（501至506）被纵向放置并与散热器（601）接触。 包括在半导体模块（501至506）中的半导体芯片的每个表面的垂直线垂直于电动机（30）的轴线。 因此，电容器（701〜706）的配置使得至少一部分电容器（701〜706）在电动机（30）的轴向上与半导体模块（501〜506）和散热片（601）重叠， 。
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5.发明授权Drive apparatus adapted to promote heat dissipation from electronic circuit integrated therein 有权驱动装置适于促进从其中集成的电子电路的散热公开(公告)号：US08304942B2
公开(公告)日：2012-11-06
申请号：US12822396
申请日：2010-06-24
CPC分类号： H02K11/024 , H02K3/522 , H02K11/05 , H02K11/33 , H02K2203/09 , H02K2211/03
摘要： A drive apparatus has a motor device having a tubular motor case. A stator is arranged radially inside the motor case. A rotor is arranged radially inside the stator. A shaft is rotatable with the rotor. An electronic circuit is arranged in the central axis direction of the shaft relative to the motor case. A choke coil has a hole in a central part thereof, in which the shaft is inserted.
摘要翻译： 驱动装置具有具有管状电动机壳体的电动机装置。 电动机壳体内径向配置定子。 转子径向布置在定子内。 轴可随转子旋转。 电子电路相对于电动机壳体设置在轴的中心轴线方向上。 扼流线圈在其中心部分具有孔，其中插入有轴。
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公开(公告)号：US20120098391A1
公开(公告)日：2012-04-26
申请号：US13336492
申请日：2011-12-23
IPC分类号： H02K5/22
CPC分类号： H02K11/0073 , B62D5/0406 , H02K3/50 , H02K5/225 , H02K9/22 , H02K11/33
摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).
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公开(公告)号：US20100327678A1
公开(公告)日：2010-12-30
申请号：US12822396
申请日：2010-06-24
CPC分类号： H02K11/024 , H02K3/522 , H02K11/05 , H02K11/33 , H02K2203/09 , H02K2211/03
摘要： A drive apparatus has a motor device having a tubular motor case. A stator is arranged radially inside the motor case. A rotor is arranged radially inside the stator. A shaft is rotatable with the rotor. An electronic circuit is arranged in the central axis direction of the shaft relative to the motor case. A choke coil has a hole in a central part thereof, in which the shaft is inserted.
摘要翻译： 驱动装置具有具有管状电动机壳体的电动机装置。 电动机壳体内径向配置定子。 转子径向布置在定子内。 轴可随转子旋转。 电子电路相对于电动机壳体设置在轴的中心轴线方向上。 扼流线圈在其中心部分具有孔，其中插入有轴。
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8.发明授权Drive apparatus having a motor, a heat sink, and a plurality of semiconductor modules 有权具有马达，散热器和多个半导体模块的驱动装置公开(公告)号：US09000633B2
公开(公告)日：2015-04-07
申请号：US13379096
申请日：2010-06-23
CPC分类号： H02K11/0073 , B62D5/0406 , H02K5/225 , H02K11/33 , H02K2211/03
摘要： A heat sink has two heat radiation blocks. The heat radiation block is formed in a wide column shape. The heat radiation block has connection parts at both ends. The connection parts have respective holes formed to pass through in the axial direction of a motor. One screw is inserted in one connection part and threaded into a motor case. The other screw is inserted in the other connection part and threaded into the motor case together with a cover. A power module forming an inverter circuit of each of two power supply systems is arranged on each heat radiation blocks.
摘要翻译： 散热片有两个散热块。 散热块形成为宽的柱状。 散热块在两端具有连接部分。 连接部具有形成为沿电动机的轴向通过的各个孔。 一个螺丝插入一个连接部分并拧入电机外壳。 另一个螺钉插入另一个连接部分，并与盖子一起拧入电机外壳。 形成两个电源系统中的每一个的逆变器电路的功率模块布置在每个散热块上。
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公开(公告)号：US08957557B2
公开(公告)日：2015-02-17
申请号：US13380321
申请日：2010-06-23
CPC分类号： H02K11/0073 , B62D5/0406 , H02K3/50 , H02K5/225 , H02K9/22 , H02K11/33
摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).
摘要翻译： 包括半导体模块（501至506）和电容器（701至706）的电子控制单元（50,70）设置在电动机（30）的轴向上。 半导体模块（501至506）被纵向放置并与散热器（601）接触。 包括在半导体模块（501至506）中的半导体芯片的每个表面的垂直线垂直于电动机（30）的轴线。 因此，电容器（701〜706）的配置使得至少一部分电容器（701〜706）在电动机（30）的轴向上与半导体模块（501〜506）和散热片（601）重叠， 。
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公开(公告)号：US20120098366A1
公开(公告)日：2012-04-26
申请号：US13380321
申请日：2010-06-23
IPC分类号： H02K5/00
CPC分类号： H02K11/0073 , B62D5/0406 , H02K3/50 , H02K5/225 , H02K9/22 , H02K11/33
摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).
摘要翻译： 包括半导体模块（501至506）和电容器（701至706）的电子控制单元（50,70）设置在电动机（30）的轴向上。 半导体模块（501至506）被纵向放置并与散热器（601）接触。 包括在半导体模块（501至506）中的半导体芯片的每个表面的垂直线垂直于电动机（30）的轴线。 因此，电容器（701〜706）的配置使得至少一部分电容器（701〜706）在电动机（30）的轴向上与半导体模块（501〜506）和散热片（601）重叠， 。
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