公开(公告)号：US20130153029A1

公开(公告)日：2013-06-20

申请号：US13326861

申请日：2011-12-15

申请人： Bradley Crume ,  Max William Reed ,  Loucas Tsakalakos ,  Jeffrey Scott Erlbaum ,  Troy Alan Berens ,  Jeffrey Todd Knapp ,  Venkata Sai Rahul Chandra Abbaraju

发明人： Bradley Crume ,  Max William Reed ,  Loucas Tsakalakos ,  Jeffrey Scott Erlbaum ,  Troy Alan Berens ,  Jeffrey Todd Knapp ,  Venkata Sai Rahul Chandra Abbaraju

IPC分类号： H01L31/0203 ,  B29C65/54

CPC分类号： H01L31/02013 ,  F16B11/006 ,  Y02E10/50

摘要： Methods are generally provided for adhering a support insert within a connection aperture defined in an encapsulating substrate of a photovoltaic device that has a first lead. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulating substrate. The method can, in one particular embodiment, include threading the first lead through the connection aperture; and positioning a support insert within the connection aperture such that the first lead is still able to extend through the connection aperture. The support insert can generally define a channel within its construction that extends from a channel opening in the support insert to an exit port. An adhesive composition can be injected into the channel opening such that a first amount of the adhesive composition flows through the channel and out of the exit port to bond the support insert within the connection aperture.

摘要翻译： 通常提供用于将支撑插入件粘附在限定在具有第一引线的光伏器件的封装衬底中的连接孔内的方法。 连接孔通常具有由封装衬底的孔壁限定的周边。 在一个具体实施例中，该方法可以包括将第一引线穿过连接孔; 并且将支撑插入件定位在连接孔内，使得第一引线仍然能够延伸穿过连接孔。 支撑插入件通常可以在其结构内限定从支撑插入件中的通道开口延伸到出口的通道。 可以将粘合剂组合物注入通道开口中，使得第一量的粘合剂组合物流过通道并流出出口以将支撑插入件接合在连接孔内。

公开(公告)号：US20130153002A1

公开(公告)日：2013-06-20

申请号：US13326814

申请日：2011-12-15

申请人： Max William Reed ,  Bradley Crume ,  Loucas Tsakalakos ,  Jeffrey Scott Erlbaum ,  Troy Alan Berens ,  Jeffrey Todd Knapp

发明人： Max William Reed ,  Bradley Crume ,  Loucas Tsakalakos ,  Jeffrey Scott Erlbaum ,  Troy Alan Berens ,  Jeffrey Todd Knapp

IPC分类号： H01L31/048

CPC分类号： H01L31/02013 ,  H02S40/34 ,  Y02E10/50

摘要： Photovoltaic devices that include a transparent substrate; a plurality of thin film layers defining a plurality of photovoltaic cells connected in series to each other on the transparent substrate; a first lead connected to one of the photovoltaic cells; and an encapsulation substrate on the plurality of thin film layers are provided. The encapsulation substrate defines a connection aperture through which the first lead extends. A support insert, which defines a plug portion and a flange, can be positioned within the connection aperture such that the flange extends over the back surface of the encapsulation substrate. The support insert can be configured to mechanically support the transparent substrate in an area opposite to the connection aperture while still enabling the first lead to extend through the connection aperture while the support insert is in place within the connection aperture.

摘要翻译： 包括透明基板的光伏器件; 多个薄膜层，限定在所述透明基板上彼此串联连接的多个光伏电池; 连接到一个光伏电池的第一引线; 并且设置在多个薄膜层上的封装基板。 封装基板限定了第一引线延伸通过的连接孔。 限定塞子部分和凸缘的支撑插入件可以定位在连接孔内，使得凸缘延伸在封装基板的背面上。 支撑插入件可以被配置为在与连接孔相对的区域中机械地支撑透明基板，同时仍允许第一引线延伸穿过连接孔，同时支撑插件在连接孔内就位。

公开(公告)号：US20130153003A1

公开(公告)日：2013-06-20

申请号：US13326889

申请日：2011-12-15

申请人： Troy Alan Berens ,  Bradley Crume ,  Loucas Tsakalakos ,  Jeffrey Scott Erlbaum ,  Max William Reed

发明人： Troy Alan Berens ,  Bradley Crume ,  Loucas Tsakalakos ,  Jeffrey Scott Erlbaum ,  Max William Reed

IPC分类号： H01L31/048 ,  H01L31/18

CPC分类号： H01L31/02013 ,  H02S40/34 ,  Y02E10/50

摘要： Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate can be positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulation substrate. An adhesive plug can be positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. A back plate or back washer can also be bonded to the adhesive plug and/or back surface of the encapsulation substrate to help dissipate energy in and/or provide support to the encapsulation substrate. Methods are also provided for mechanically supporting a transparent substrate in an area opposite to a connection aperture defined in an encapsulation substrate.

摘要翻译： 提供了光伏器件，其包括：透明衬底; 玻璃基板上的多个薄膜层; 以及连接到一个光伏电池的第一引线。 封装衬底可以定位在多个薄膜层上，并且限定了第一引线延伸通过的连接孔。 连接孔通常具有由封装衬底的孔壁限定的周边。 粘合塞可以位于连接孔内，以在连接孔的区域中机械地支撑透明基底。 背板或后垫圈也可以结合到封装基板的粘合塞和/或后表面，以帮助耗散能量和/或提供对封装基板的支撑。 还提供了用于在与封装衬底中限定的连接孔相对的区域中机械地支撑透明衬底的方法。

公开(公告)号：US20130153001A1

公开(公告)日：2013-06-20

申请号：US13326775

申请日：2011-12-15

申请人： Max William Reed ,  Jeffrey Todd Knapp ,  Troy Alan Berens ,  Venkata Sai Rahul Chandra Abbaraju ,  Bradley Crume

发明人： Max William Reed ,  Jeffrey Todd Knapp ,  Troy Alan Berens ,  Venkata Sai Rahul Chandra Abbaraju ,  Bradley Crume

IPC分类号： H01L31/048

CPC分类号： H02S40/34 ,  F24S25/00 ,  F24S80/50 ,  F24S2025/011 ,  H01L31/02013 ,  H01R13/5205 ,  Y02E10/47 ,  Y02E10/50

摘要： Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate is positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture has a perimeter defined by an aperture wall of the encapsulation substrate. A support insert is positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. The support insert is configured such that the first lead is able to extend through the connection aperture while the support insert in place within the connection aperture. A kit is also provided that includes an encapsulation substrate defining a connection aperture; and, a support insert configured to be coupled within the connection aperture of the encapsulation substrate.

摘要翻译： 提供了光伏器件，其包括：透明衬底; 玻璃基板上的多个薄膜层; 以及连接到一个光伏电池的第一引线。 封装衬底位于多个薄膜层上，并且限定了第一引线延伸通过的连接孔。 连接孔具有由封装衬底的孔壁限定的周边。 支撑插入件位于连接孔内，以在连接孔的区域中机械地支撑透明基底。 支撑插入件构造成使得第一引线能够延伸穿过连接孔，同时支撑件插入连接孔内的适当位置。 还提供了一种套件，其包括限定连接孔的封装衬底; 以及被配置为耦合在所述封装基板的连接孔内的支撑插入件。