公开(公告)号：US12074344B2

公开(公告)日：2024-08-27

申请号：US18010499

申请日：2021-06-25

申请人： Medtronic, Inc.

发明人： Hailiang Zhao ,  David Buendorf ,  Erik J. Hovland ,  Vadim A. Yakolev

IPC分类号： H01M50/536 ,  H01M50/534 ,  H01M50/54

CPC分类号： H01M50/536 ,  H01M50/534 ,  H01M50/54

摘要： Devices and methods disclosed herein relate to forming superior mechanical and electrical connections between stacks of foils such as those used in electrochemical cells. The connections described herein use multiple weld types and choice of materials to promote electrical and mechanical connectivity using separate weld types.