公开(公告)号：US20210236767A1

公开(公告)日：2021-08-05

申请号：US17162101

申请日：2021-01-29

Applicant: Medtronic, Inc.

Inventor： Kenneth D. Warnock, JR. ,  Dale F. Seeley ,  Jonathan E. Baxter ,  Gonzalo Martinez

IPC: A61M25/00

Abstract: A filament wrapping and reflow system and a method therefrom. The method including wrapping a filament around an elongate substrate along a longitudinal direction between a proximal end of the elongate substrate and a distal end of the elongate substrate. The method also including melting the filament to form at least a portion of the elongate medical device. The system including a substrate system, a filament system, a heater, one or more actuators, and a controller.