公开(公告)号：US20220379121A1

公开(公告)日：2022-12-01

申请号：US17663601

申请日：2022-05-16

Applicant: Medtronic, Inc.

Inventor： Bernard Q. Li ,  Richard T. Stone ,  Alan Shi ,  Seth M. Humphrys ,  Wen Tan ,  Nicholas D. Stepka

IPC: A61N1/375 ,  C22C14/00 ,  C22F1/18

Abstract: In some examples, the disclosure relates to a medical device such as an implantable medical lead. The medical lead may include: a lead body including an electrically conductive lead wire; an electrical contact on a proximal portion of the lead body, the electrical contact including a contact substrate; and an electrode on a distal portion of the lead body, the electrode including an electrode substrate, wherein the electrode substrate is electrically coupled to the contact substrate via the electrically conductive lead wire, wherein the lead wire is formed of a composition comprising titanium or titanium alloys, wherein the electrode substrate is formed of a first beta-titanium alloy, and wherein the contact substrate is formed of a second beta-titanium alloy.