METHOD FOR FABRICATING AN IMPLANTABLE ELECTRODE
    4.
    发明申请
    METHOD FOR FABRICATING AN IMPLANTABLE ELECTRODE 审中-公开
    用于制造可植入电极的方法

    公开(公告)号:US20150283375A1

    公开(公告)日:2015-10-08

    申请号:US14743838

    申请日:2015-06-18

    CPC classification number: A61N1/05 C23C28/32 Y10T29/49204

    Abstract: A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.

    Abstract translation: 一种用于制造可植入医疗电极的方法包括使电极基板粗糙化,施加粘合层,以及在优化以最小化电极阻抗和脉冲后极化的条件下,在粘附层上沉积阀金属氧化物涂层。 电极基板可以是各种电极金属或包括钛,铂,铂 - 铱或铌的合金。 粘合层可以由钛或锆形成。 阀金属氧化物涂层是在受控目标功率,溅射压力和溅射气体比设置下溅射到粘附层上的氧化钌涂层,其被优化以最小化电极阻抗和后脉冲极化。

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