公开(公告)号：US10561851B2

公开(公告)日：2020-02-18

申请号：US15638056

申请日：2017-06-29

Applicant: Medtronic, Inc.

Inventor： Mark Breyen ,  Tom Miltich ,  Gordon Munns

IPC: A61N1/375 ,  B23K35/30 ,  B23K35/32 ,  B23K101/38

Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 μm. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.