公开(公告)号：US20210018574A1

公开(公告)日：2021-01-21

申请号：US17030900

申请日：2020-09-24

Applicant: Melexis Technologies SA

Inventor： Jian CHEN ,  Matthijs PARDOEN ,  Arnaud LAVILLE ,  Orlin GUEORGUIEV SARADJOV

IPC: G01R33/00 ,  G01R33/02

Abstract: A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing and connected to the lead frame. The housing comprising at least two recesses or at least two lateral protrusions arranged on two opposite sides of the housing, for allowing the sensor to be mounted to the support. A component assembly comprising said sensor mounted on a support, the support comprising a plurality of first and second posts and a plurality of electrical contacts. A method of producing said component assembly, comprising the step of arranging said sensor with its elongated leads adjacent the first posts, and arranging its lateral protrusions and/or lateral recesses adjacent the second posts, and connecting the elongated leads to the electrical contacts.