公开(公告)号：US20240114226A1

公开(公告)日：2024-04-04

申请号：US17564889

申请日：2021-12-29

Applicant: Meta Platforms Technologies, LLC

Inventor： Andrew Samuel Berkovich ,  Warren Andrew Hunt ,  Daniel Morgan ,  Shlomo Alkalay ,  Jack Thomas Lavier

IPC: H04N5/225 ,  G06F3/01 ,  G06V10/25 ,  G09G3/32 ,  H01L23/00 ,  H01L27/146 ,  H01L27/15 ,  H04N5/232

CPC classification number: H04N5/2257 ,  G06F3/013 ,  G06V10/25 ,  G09G3/32 ,  H01L24/08 ,  H01L24/16 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/156 ,  H04N5/2252 ,  H04N5/232 ,  G09G2360/18 ,  H01L2224/08145 ,  H01L2224/16145

Abstract: In one example, an apparatus for integrating sensing and display system includes a first semiconductor layer that includes an image sensor; a second semiconductor layer that includes a display; a third semiconductor layer that includes compute circuits configured to support an image sensing operation by the image sensor and a display operation by the display; and a semiconductor package that encloses the first, second, and third semiconductor layers, the semiconductor package further including a first opening to expose the image sensor and a second opening to expose the display. The first, second, and third semiconductor layers form a first stack structure along a first axis. The third semiconductor layer is sandwiched between the first semiconductor layer and the second semiconductor layer in the first stack structure.