公开(公告)号：US20250013002A1

公开(公告)日：2025-01-09

申请号：US17967870

申请日：2022-10-17

Applicant: Meta Platforms Technologies, LLC

Inventor： Gue Hyung Kwon ,  Yi Zhou ,  Yizhi Xiong ,  Ying Zhou

IPC: G02B7/02 ,  G03B30/00 ,  H04N5/225 ,  H05K1/02 ,  H05K1/18

Abstract: Embodiments of the present disclosure relate to an electronic module that is structured to be incorporated into a small form factor electronic device. The electronic module includes a substrate, an active component and a passive component. The substrate includes a first surface and a second surface that is opposite the first surface. The second surface of the substrate includes a recessed area that extends through a portion of the substrate towards the first surface of the substrate. The active component is placed on the first surface of the substrate and the passive component is located in the recessed area of the second surface of the substrate.