公开(公告)号：US06695572B2

公开(公告)日：2004-02-24

申请号：US09966156

申请日：2001-09-28

申请人： Michael Antonell ,  Erik Cho Houge ,  Larry E. Plew ,  Catherine Vartuli ,  Jennifer Juszczak

发明人： Michael Antonell ,  Erik Cho Houge ,  Larry E. Plew ,  Catherine Vartuli ,  Jennifer Juszczak

IPC分类号： B65G4907

CPC分类号： H01L21/6732

摘要： A method and apparatus for minimizing the surface contamination of semiconductor wafers (11) during the semiconductor device manufacturing process. Semiconductor wafers (11) are stored in a storage cassette (12) with their face sides (17) facing downward and their back sides (16) facing upward. Particulate contamination present on the back sides of the wafers is thereby secured to the wafers by the force of gravity, and the faces of the wafers are shielded from falling debris. An automated wafer handling device (19) is provided with a rotary joint (22) to accomplish the wafer flipping motion before inserting a wafer into a cassette and after removing the wafer from the cassette.

摘要翻译： 一种在半导体器件制造过程中最小化半导体晶片（11）的表面污染的方法和装置。 半导体晶片（11）被储存在存储盒（12）中，其表面（17）面向下并且它们的背面（16）面向上。 因此，通过重力将晶片的背面存在的颗粒污染物固定在晶片上，并且晶片的表面被遮蔽而不会掉落。 自动晶片处理装置（19）设置有旋转接头（22），以在将晶片插入盒内并在从盒中取出晶片之后实现晶片翻转运动。