公开(公告)号：US06678540B2

公开(公告)日：2004-01-13

申请号：US09935037

申请日：2001-08-22

申请人： Michael S. Wire ,  Quentin P. Herr

发明人： Michael S. Wire ,  Quentin P. Herr

IPC分类号： H01P100

CPC分类号： H01P1/047 ,  Y10S505/70 ,  Y10S505/703 ,  Y10S505/706

摘要： A superconductor on-chip microstrip line (2, 4) to off-chip microstrip line (7) transition of low characteristic impedance (15, 20, 22) is realized that obtains a bandwidth of 200 GHz for MCM application while employing solder bump (15, 17) technology to connect the chips (3, 5) to the off-chip microstrip and substrate (6). Circular openings (20, 22) through the respective ground plane layers (10 & 16) of the off-chip and on-chip microstrips are provided in positions respectively underlying and overlying the solder bump (15) for the signal. The openings may be sized to provide a desired ratio of inductance to capacitance, the larger the size, the greater the ratio value. This technique may be used to match characteristic impedance to give broad bandwidth low impedance interconnections needed for direct SFQ chip-to-chip communication on a passive MCM.

摘要翻译： 实现了超导体片上微带线（2,4）到片外微带线（7）低特性阻抗（15,20,22）的转换，在采用焊料凸块时获得了MCM应用的200 GHz带宽（ 将芯片（3,5）连接到片外微带和基板（6）的技术。 提供片外微芯片的各个接地平面层（10和16）的圆形开口（20,22）分别设置在用于信号的焊料凸点（15）的下面和上方的位置上。 开口的尺寸可以提供所需的电感与电容的比例，尺寸越大，比值越大。 该技术可用于匹配特性阻抗，以提供无源MCM上直接SFQ芯片到芯片通信所需的宽带宽低阻抗互连。

公开(公告)号：US5831489A

公开(公告)日：1998-11-03

申请号：US715944

申请日：1996-09-19

申请人： Michael S. Wire

发明人： Michael S. Wire

IPC分类号： H05K9/00 ,  H01L39/00 ,  H05K5/04

CPC分类号： H05K9/0075

摘要： Operating high frequency cryogenic superconductor devices requires an enclosure that permits application of wide band RF signals from an external source to the superconductor device while maintaining the device at cryogenic temperatures in an essentially magnetic field free environment. A magnetic field shielding enclosure is formed of inner (5, 7) and outer (9, 11) mumetal containers, one larger than the other in size. Each of those containers is formed of two open-ended container like pieces that are nested together with overlapping side walls to define two generally closed regions, the first containing the cryogenic superconductor device (1) and the second (9, 11) containing the first container (5, 7). A shielded high bandwidth transmission line (12), sufficiently compliant physically, is snaked through slight clearance spaces between the pieces of each of those containers to the superconductor device. Suitably the shielded transmission line is formed of materials having a thermal conductivity less than the thermal conductivity of the metal copper.

摘要翻译： 工作的高频低温超导体器件需要一种外壳，其允许将宽带RF信号从外部源施加到超导体器件，同时将器件保持在基本无磁场环境中的低温温度。 磁场屏蔽罩由内（5,7）和外（9,11）的母体容器形成，一个大于另一个。 这些容器中的每一个由两个开口的容器形成，其嵌套在一起具有重叠的侧壁，以限定两个通常封闭的区域，第一容器包含低温超导体装置（1），第二容纳第一（9,11） 容器（5,7）。 在物理上足够柔顺的屏蔽高带宽传输线（12）通过这些容器中的每个这些容器之间的微小的间隙空间被穿过超导体器件。 适当地，屏蔽传输线由具有小于金属铜的热导率的导热性的材料形成。