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公开(公告)号:US11464952B2
公开(公告)日:2022-10-11
申请号:US16403360
申请日:2019-05-03
Applicant: MicroVention, Inc.
Inventor: Wenmar Badbada , Nga Ting Wong , Heath Bowman , Matt Biggers , Joseph Rye , Jared Shimizu
Abstract: A shunt system used to treat excess cerebrospinal fluid (CSF) accumulation is described. In some embodiments, the system utilizes various mechanical, electrical, or electromechanical concepts designed to either clean a portion of the shunt system, or customize CSF drainage.
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公开(公告)号:US12114863B2
公开(公告)日:2024-10-15
申请号:US16705097
申请日:2019-12-05
Applicant: MicroVention, Inc.
Inventor: Heath Bowman , Nga Ting Wong , Diana N. Valencia
CPC classification number: A61B17/1214 , A61B17/12113 , A61F6/22 , A61B2017/00526 , A61B2017/00632 , A61B2017/12068 , A61B2090/3983 , A61F2/011 , A61F2002/9665
Abstract: An implant delivery system having an implant-pusher junction that has improved flexibility due to a shortened heater and tapered marker band. The heater capsule includes a coil having a complex shape made possible through additive manufacturing. The complex shape generates increased heat over a shorter length when compared to traditional linear coils. The marker band includes a tapered end that allows the implant to pivot relative to the pusher.
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公开(公告)号:US20190336735A1
公开(公告)日:2019-11-07
申请号:US16403360
申请日:2019-05-03
Applicant: MicroVention, Inc.
Inventor: Wenmar Badbada , Nga Ting Wong , Heath Bowman , Matt Biggers , Joseph Rye , Jared Shimizu
Abstract: A shunt system used to treat excess cerebrospinal fluid (CSF) accumulation is described. In some embodiments, the system utilizes various mechanical, electrical, or electromechanical concepts designed to either clean a portion of the shunt system, or customize CSF drainage.
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公开(公告)号:US20250082337A1
公开(公告)日:2025-03-13
申请号:US18886808
申请日:2024-09-16
Applicant: MicroVention, Inc.
Inventor: Heath Bowman , Nga Ting Wong , Diana N. Valencia
Abstract: An implant delivery system having an implant-pusher junction that has improved flexibility due to a shortened heater and tapered marker band. The heater capsule includes a coil having a complex shape made possible through additive manufacturing. The complex shape generates increased heat over a shorter length when compared to traditional linear coils. The marker band includes a tapered end that allows the implant to pivot relative to the pusher.
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公开(公告)号:US20230017481A1
公开(公告)日:2023-01-19
申请号:US17935882
申请日:2022-09-27
Applicant: MicroVention, Inc.
Inventor: Wenmar Badbada , Nga Ting Wong , Heath Bowman , Matt Biggers , Joseph Rye , Jared Shimizu
Abstract: A shunt system used to treat excess cerebrospinal fluid (CSF) accumulation is described. In some embodiments, the system utilizes various mechanical, electrical, or electromechanical concepts designed to either clean a portion of the shunt system, or customize CSF drainage.
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公开(公告)号:US20200178975A1
公开(公告)日:2020-06-11
申请号:US16705097
申请日:2019-12-05
Applicant: MicroVention, Inc.
Inventor: Heath Bowman , Nga Ting Wong , Diana N. Valencia
Abstract: An implant delivery system having an implant-pusher junction that has improved flexibility due to a shortened heater and tapered marker band. The heater capsule includes a coil having a complex shape made possible through additive manufacturing. The complex shape generates increased heat over a shorter length when compared to traditional linear coils. The marker band includes a tapered end that allows the implant to pivot relative to the pusher.
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