公开(公告)号：US20220115282A1

公开(公告)日：2022-04-14

申请号：US17556790

申请日：2021-12-20

Applicant: Microchip Technology Inc.

Inventor： Matthias Klein ,  Andreas Zakrzewski ,  Richard Gruenwald

IPC: H01L23/16 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A method for forming a packaged electronic die includes forming a plurality of bonding pads on a device wafer. A photoresist layer is deposited over the device wafer and is patterned so as to form a photoresist frame that completely surrounds a device formed on the device wafer. Conductive balls are deposited over the bonding pads. The wafer is cut to form the electronic die and the electronic die is placed over the substrate. The conductive balls are heated and compressed, moving the electronic die closer to the substrate such that the photoresist frame is in direct contact with the substrate or with a landing pad formed on the substrate. Encapsulant material is deposited such that the encapsulant material covers the electronic die and the substrate. The encapsulant material is cured so as to encapsulate the electronic die. The substrate is cut to separate the packaged electronic die.

公开(公告)号：US20210111082A1

公开(公告)日：2021-04-15

申请号：US16816010

申请日：2020-03-11

Applicant: Microchip Technology Inc.

Inventor： Matthias Klein ,  Andreas Zakrzewski ,  Richard Gruenwald

IPC: H01L23/16 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A packaged electronic die having a micro-cavity and a method for forming a packaged electronic die. The packaged electronic die includes a photoresist frame secured to the electronic die and extending completely around the device. The photoresist frame is further secured to a first major surface of a substrate so as to form an enclosure around the device. Encapsulant material extends over the electronic die and around the sides of the electronic die. The encapsulant material is in contact with the first major surface of the substrate around the entire periphery of the electronic die so as to form a seal around the electronic die.

公开(公告)号：US11538726B2

公开(公告)日：2022-12-27

申请号：US17556790

申请日：2021-12-20

Applicant: Microchip Technology Inc.

Inventor： Matthias Klein ,  Andreas Zakrzewski ,  Richard Gruenwald

IPC: H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/00

Abstract: A method for forming a packaged electronic die includes forming a plurality of bonding pads on a device wafer. A photoresist layer is deposited over the device wafer and is patterned so as to form a photoresist frame that completely surrounds a device formed on the device wafer. Conductive balls are deposited over the bonding pads. The wafer is cut to form the electronic die and the electronic die is placed over the substrate. The conductive balls are heated and compressed, moving the electronic die closer to the substrate such that the photoresist frame is in direct contact with the substrate or with a landing pad formed on the substrate. Encapsulant material is deposited such that the encapsulant material covers the electronic die and the substrate. The encapsulant material is cured so as to encapsulate the electronic die. The substrate is cut to separate the packaged electronic die.

公开(公告)号：US11244876B2

公开(公告)日：2022-02-08

申请号：US16816010

申请日：2020-03-11

Applicant: Microchip Technology Inc.

Inventor： Matthias Klein ,  Andreas Zakrzewski ,  Richard Gruenwald

IPC: H01L23/16 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A packaged electronic die having a micro-cavity and a method for forming a packaged electronic die. The packaged electronic die includes a photoresist frame secured to the electronic die and extending completely around the device. The photoresist frame is further secured to a first major surface of a substrate so as to form an enclosure around the device. Encapsulant material extends over the electronic die and around the sides of the electronic die. The encapsulant material is in contact with the first major surface of the substrate around the entire periphery of the electronic die so as to form a seal around the electronic die.