公开(公告)号：US20200258593A1

公开(公告)日：2020-08-13

申请号：US16786748

申请日：2020-02-10

Applicant: Micron Technology, Inc.

Inventor： Fuad Badrieh ,  Thomas H. Kinsley ,  Beakkyu Choi

IPC: G11C29/54 ,  G11C29/50 ,  G06F30/367

Abstract: Systems, apparatuses, and methods for on-die memory power analytics and management are described. In some examples, the memory analytics and management may include a frequency-dependent analysis or simulation model of a memory die to determine an operating characteristic of the die. A set of ports of the memory die may be selected and one or more alternating current (AC) excitation signals may be applied to the ports to determine an impedance associated with the ports. The impedance may be used to determine one or more parameters (e.g., scattering, impedance) to analyze a die and for subsequently managing power distribution on the die. Analytics on a subset of ports on a die may be used to simulate the electrical response of the entire memory die and thus manage power delivery for the die.