公开(公告)号：US20220181307A1

公开(公告)日：2022-06-09

申请号：US17682948

申请日：2022-02-28

Applicant: Micron Technology, Inc.

Inventor： Kelvin Tam Aik Boo ,  Chin-Hui Chong ,  Seng Kim Ye ,  Hong Wan Ng ,  Hem P. Takiar

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

Abstract: An apparatus includes a substrate for mounting an integrated circuit. The substrate includes a primary layer including a first surface that is a first external surface of the substrate. The substrate includes an inner layer that is located below the primary layer and including a second surface. A portion of the second surface of the inner layer is exposed via an open area associated with the primary layer. The inner layer includes a first multiple of wire bond pads that are exposed via the open area associated with the primary layer.