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公开(公告)号:US20220181307A1
公开(公告)日:2022-06-09
申请号:US17682948
申请日:2022-02-28
Applicant: Micron Technology, Inc.
Inventor: Kelvin Tam Aik Boo , Chin-Hui Chong , Seng Kim Ye , Hong Wan Ng , Hem P. Takiar
IPC: H01L25/065 , H01L23/498 , H01L23/00 , H01L25/00
Abstract: An apparatus includes a substrate for mounting an integrated circuit. The substrate includes a primary layer including a first surface that is a first external surface of the substrate. The substrate includes an inner layer that is located below the primary layer and including a second surface. A portion of the second surface of the inner layer is exposed via an open area associated with the primary layer. The inner layer includes a first multiple of wire bond pads that are exposed via the open area associated with the primary layer.