公开(公告)号：US20230395317A1

公开(公告)日：2023-12-07

申请号：US18203735

申请日：2023-05-31

Applicant: Micron Technology, Inc.

Inventor： Timothy Hollis ,  David Ovard

IPC: H01F27/40 ,  H01F27/30

CPC classification number: H01F27/402 ,  H01F27/306

Abstract: Systems, methods and apparatus are provided for a multi-coil induction apparatus. The multi-coil induction apparatus has a primary coil structure with a primary first coil portion and a primary second coil portion where both are on a common planar surface; and a secondary coil structure having a secondary first coil portion and a secondary second coil, where the secondary first coil portion and the secondary second coil portion are coplanar with the primary first coil portion and the primary second coil. The primary first coil portion and the secondary first coil portion concentrically turn on the common planar surface to form a coupled induction section while the primary second coil portion and the secondary second coil portion are adjacent the coupled induction section on the common planar surface.