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公开(公告)号:US11726873B2
公开(公告)日:2023-08-15
申请号:US17556550
申请日:2021-12-20
Applicant: Micron Technology, Inc.
Inventor: Da Hong , Kexian Huang , Qing Xu
CPC classification number: G06F11/1068 , G06F11/076 , G06F11/0772 , G06F11/3037 , G06F12/0238
Abstract: A system, method and apparatus to optimize repair in a memory module based on hardware errors identified by microprocessors and a configurable error handling policy. For example, the error handling policy can have a configuration file identifying an amount of repair resources available in the memory module as manufactured. Repair status data can be stored in the memory module to determine repair resources currently available for repair. Further, the error handling policy can be configured with a list of high risk memory addresses prioritized for repair. The list can be used to schedule proactive repair in response to memory errors that would otherwise not be repaired during a typical restarting of the computer system having the memory module.
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2.
公开(公告)号:US11720438B2
公开(公告)日:2023-08-08
申请号:US17245761
申请日:2021-04-30
Applicant: Micron Technology, Inc.
Inventor: Da Hong , Kexian Huang , Qing Xu
CPC classification number: G06F11/0793 , G06F11/0772 , G06F11/1407 , G06F11/3079
Abstract: A system, method and apparatus to record data relevant to hardware errors identified by microprocessors. For example, in response to a hardware error, a microprocessor can store first data about the error in registers in the microprocessor and start to execute instructions configured in firmware and/or in an operating system. Execution of the instructions in response to the hardware error causes the microprocessor to: generating second data about the error based at least in part on the first data in the registers; and store the second data at a location not affected by restarting execution of an operating system in the processor. For example, the execution of the instructions can cause the microprocessor to decode the first data to obtain a temperature of the computing device as part of the second data.
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公开(公告)号:US20230195568A1
公开(公告)日:2023-06-22
申请号:US17556550
申请日:2021-12-20
Applicant: Micron Technology, Inc.
Inventor: Da Hong , Kexian Huang , Qing Xu
CPC classification number: G06F11/1068 , G06F11/0772 , G06F11/076 , G06F11/3037 , G06F12/0238
Abstract: A system, method and apparatus to optimize repair in a memory module based on hardware errors identified by microprocessors and a configurable error handling policy. For example, the error handling policy can have a configuration file identifying an amount of repair resources available in the memory module as manufactured. Repair status data can be stored in the memory module to determine repair resources currently available for repair. Further, the error handling policy can be configured with a list of high risk memory addresses prioritized for repair. The list can be used to schedule proactive repair in response to memory errors that would otherwise not be repaired during a typical restarting of the computer system having the memory module.
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4.
公开(公告)号:US20220318087A1
公开(公告)日:2022-10-06
申请号:US17245761
申请日:2021-04-30
Applicant: Micron Technology, Inc.
Inventor: Da Hong , Kexian Huang , Qing Xu
Abstract: A system, method and apparatus to record data relevant to hardware errors identified by microprocessors. For example, in response to a hardware error, a microprocessor can store first data about the error in registers in the microprocessor and start to execute instructions configured in firmware and/or in an operating system. Execution of the instructions in response to the hardware error causes the microprocessor to: generating second data about the error based at least in part on the first data in the registers; and store the second data at a location not affected by restarting execution of an operating system in the processor. For example, the execution of the instructions can cause the microprocessor to decode the first data to obtain a temperature the computing device as part of the second data.
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