公开(公告)号：US20210074705A1

公开(公告)日：2021-03-11

申请号：US17083174

申请日：2020-10-28

Applicant: Micron Technology, Inc.

Inventor： Sanh D. Tang ,  Mitsunari Sukekawa ,  Yusuke Yamamoto ,  Christopher J. Kawamura ,  Hiroaki Taketani

IPC: H01L27/108 ,  H01L23/528

Abstract: Some embodiments include a memory device having a buried wordline, a shield plate, and an access device. The access device includes first and second diffusion regions and a channel region. The diffusion regions and the channel region are arranged vertically so that the channel region is between the first and second diffusion regions. The wordline is adjacent to a first side surface of the channel region, and the shield plate is adjacent to a second side surface of the channel region; with the first and second side surfaces being in opposing relation to one another. Some embodiments include methods of forming integrated assemblies.

公开(公告)号：US10910379B2

公开(公告)日：2021-02-02

申请号：US16354450

申请日：2019-03-15

Applicant: Micron Technology, Inc.

Inventor： Sanh D. Tang ,  Mitsunari Sukekawa ,  Yusuke Yamamoto ,  Christopher J. Kawamura ,  Hiroaki Taketani

IPC: H01L27/108 ,  H01L23/528

Abstract: Some embodiments include a memory device having a buried wordline, a shield plate, and an access device. The access device includes first and second diffusion regions and a channel region. The diffusion regions and the channel region are arranged vertically so that the channel region is between the first and second diffusion regions. The wordline is adjacent to a first side surface of the channel region, and the shield plate is adjacent to a second side surface of the channel region; with the first and second side surfaces being in opposing relation to one another. Some embodiments include methods of forming integrated assemblies.

公开(公告)号：US20200295008A1

公开(公告)日：2020-09-17

申请号：US16354450

申请日：2019-03-15

Applicant: Micron Technology, Inc.

Inventor： Sanh D. Tang ,  Mitsunari Sukekawa ,  Yusuke Yamamoto ,  Christopher J. Kawamura ,  Hiroaki Taketani

IPC: H01L27/108 ,  H01L23/528

Abstract: Some embodiments include a memory device having a buried wordline, a shield plate, and an access device. The access device includes first and second diffusion regions and a channel region. The diffusion regions and the channel region are arranged vertically so that the channel region is between the first and second diffusion regions. The wordline is adjacent to a first side surface of the channel region, and the shield plate is adjacent to a second side surface of the channel region; with the first and second side surfaces being in opposing relation to one another. Some embodiments include methods of forming integrated assemblies.

公开(公告)号：US11706909B2

公开(公告)日：2023-07-18

申请号：US17083174

申请日：2020-10-28

Applicant: Micron Technology, Inc.

Inventor： Sanh D. Tang ,  Mitsunari Sukekawa ,  Yusuke Yamamoto ,  Christopher J. Kawamura ,  Hiroaki Taketani

IPC: H10B12/00 ,  H01L23/528

CPC classification number: H10B12/31 ,  H01L23/5283 ,  H10B12/033 ,  H10B12/05 ,  H10B12/488

Abstract: Some embodiments include a memory device having a buried wordline, a shield plate, and an access device. The access device includes first and second diffusion regions and a channel region. The diffusion regions and the channel region are arranged vertically so that the channel region is between the first and second diffusion regions. The wordline is adjacent to a first side surface of the channel region, and the shield plate is adjacent to a second side surface of the channel region; with the first and second side surfaces being in opposing relation to one another. Some embodiments include methods of forming integrated assemblies.