公开(公告)号：US08256499B2

公开(公告)日：2012-09-04

申请号：US12534883

申请日：2009-08-04

申请人： Min Li ,  Bi-Tao Wu

发明人： Min Li ,  Bi-Tao Wu

IPC分类号： F28F7/00 ,  H01L23/467 ,  H05K5/00

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a fan and a holding frame securing the fan onto the heat sink. The holding frame is mounted on a top of the heat sink and has four beams located around the top of the heat sink and defines an opening in a central part thereof corresponding to the heat sink. The holding frame has two air-guiding plates extending inwardly and downwardly from two inner edges of two opposite beams to two opposite lateral sides of the heat sink. The fan is mounted on the holding frame and covers the opening and the two air-guiding plates of the holding frame.

摘要翻译： 散热装置包括散热器，风扇和将风扇固定到散热器上的保持框架。 保持框架安装在散热器的顶部，并且具有围绕散热器顶部的四个光束，并且在其对应于散热器的中心部分中限定开口。 保持框架具有从两个相对的梁的两个内边缘向内和向下延伸到散热器的两个相对侧面的两个空气引导板。 风扇安装在固定框架上并覆盖保持框架的开口和两个空气导向板。