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公开(公告)号:US6102748A
公开(公告)日:2000-08-15
申请号:US412883
申请日:1999-10-05
申请人: Ming-Wu Lee , Kun-Tsan Wu , Jen-Jou Chang
发明人: Ming-Wu Lee , Kun-Tsan Wu , Jen-Jou Chang
IPC分类号: H01R43/24 , H01R13/504
CPC分类号: H01R43/24
摘要: A high-density electrical connector comprises a housing, two sets of SMT contacts insert molded in opposite sides of the housing, and a shield covering the housing. The housing comprises a first housing member and a second housing member surroundingly incorporating the first housing member. A recess is defined between the first and second housing members. A method of manufacturing the high-density connector comprises the steps of: 1) insert molding a pair of SMT contact carriers to opposite sides of the first housing member; 2) insert molding the first housing member having the two SMT contact carriers to the second housing member; 3) severing carrier plates from the two SMT contact carriers; 4) assembling the shield to the housing. The first insert molding forms a base and a crossbeam retaining mounting and mating portions of the SMT contacts with a gap defined therebetween. The base defines a plurality of openings. The second insert molding fills the openings and the gap to incorporate the base and the crossbeam to form the housing.
摘要翻译: 高密度电连接器包括壳体,两组SMT触头插入模制在壳体的相对侧面中,以及覆盖壳体的屏蔽件。 壳体包括第一壳体构件和环绕第一壳体构件的第二壳体构件。 在第一和第二壳体构件之间限定凹部。 一种制造高密度连接器的方法包括以下步骤:1)将一对SMT接触载体插入到第一壳体构件的相对侧; 2)将具有两个SMT接触托架的第一壳体构件嵌入成型到第二壳体构件; 3)从两个SMT接触载体上切断载板; 4)将屏蔽件组装到外壳上。 第一插入模制件形成基座和横梁,保持SMT触头的安装和配合部分,并在其间限定间隙。 基部限定多个开口。 第二嵌件成型填充开口和间隙以结合基部和横梁以形成壳体。
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公开(公告)号:US06363607B1
公开(公告)日:2002-04-02
申请号:US09414653
申请日:1999-10-06
申请人: Chao-Hsu Chen , Ming-Wu Lee , Kun-Tsan Wu
发明人: Chao-Hsu Chen , Ming-Wu Lee , Kun-Tsan Wu
IPC分类号: H01R4300
CPC分类号: H01R43/24 , Y10T29/49218 , Y10T29/4922 , Y10T29/49222
摘要: A method of manufacturing a high density connector comprises five steps. The first step is to prepare essential elements of the connector, such as a dielectric cover, a metallic shell, a pair of guiding members and a plurality of contacts. Each contact is L-shaped and comprises a horizontal soldering portion. The second step is to first insert mold a pair of dielectric bases around the contacts to produce a contact subassembly. The three step is to second insert mold a dielectric housing around the contact subassembly to form a contact module. The forth step is to adjust the horizontal soldering portions of the contacts for ensuring a good coplanarity thereof. The fifth step is to assemble the contact module with the cover, the shell and the guiding members, thereby completing the connector. The method of the present invention can produce connection with high density contacts having good insert-molding qualities by double insert molding to form the contact module, resulting in the horizontal soldering sections of the contacts having good coplanarity and having good electrical communication quality.
摘要翻译: 制造高密度连接器的方法包括五个步骤。 第一步是准备连接器的基本元件,例如电介质盖,金属壳,一对引导构件和多个触点。 每个触点都是L形的,并且包括一个水平焊接部分。 第二步是首先在触点周围插入一对电介质基底以产生接触子组件。 三个步骤是在接触子组件周围第二次插入模制绝缘壳体以形成接触模块。 第四步是调整触点的水平焊接部分以确保其良好的共面性。 第五步是将触头模块与盖子,壳体和引导构件组装在一起,从而完成连接器。 本发明的方法可以通过双嵌入成型产生具有良好嵌入成型质量的高密度接触,形成接触模块,从而使触点的水平焊接部分具有良好的共平面性并且具有良好的电通信质量。
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公开(公告)号:US06132261A
公开(公告)日:2000-10-17
申请号:US407631
申请日:1999-09-28
申请人: Ming-Wu Lee , Kun-Tsan Wu , Song-Rong Chiou
发明人: Ming-Wu Lee , Kun-Tsan Wu , Song-Rong Chiou
IPC分类号: H01R12/50 , H01R13/405
CPC分类号: H01R23/6873
摘要: A high-density electrical connector comprises two sets of SMT contacts and two sets of DIP contacts, a dielectric housing formed by insert molding and a shield covering the housing, the dielectric housing comprises a pair of first housing members and a second housing member around the pair of first housing members, each first housing member is insert molded to a set of SMT contacts on one side thereof and a set of DIP contacts on an opposite side thereof in a first insert molding step, the second housing member is insert molded to and combines the pair of first housing members having the SMT contacts and the DIP contacts, thus, proper alignment, engagement, and coplanarity of the contacts assembled in the housing are easily obtained without interference from an insertion force.
摘要翻译: 高密度电连接器包括两组SMT触点和两组DIP触点,通过嵌件模制形成的绝缘壳体和覆盖壳体的屏蔽件,绝缘壳体包括一对第一壳体构件和围绕该壳体的第二壳体构件 一对第一壳体构件,每个第一壳体构件在第一插入模制步骤中在其一侧上插入模制到一组SMT触点和一组DIP触点,在第二插入模制步骤中,第二壳体构件插入模制到 组合具有SMT触点的一对第一壳体构件和DIP触点,从而容易地获得组装在壳体中的触头的适当对准,接合和共面性,而不会受到插入力的干扰。
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