公开(公告)号：US6159082A

公开(公告)日：2000-12-12

申请号：US257726

申请日：1999-03-02

申请人： Misuo Sugiyama ,  Xu Jin Wang ,  Shinya Iida

发明人： Misuo Sugiyama ,  Xu Jin Wang ,  Shinya Iida

IPC分类号： B24B37/00 ,  B24B57/02 ,  B24B1/00

CPC分类号： B24B37/04 ,  B24B57/02

摘要： The bottom of each collection groove for collecting a used abrasive slurry and a rinsing solution is formed like the letter V, an exhaust port is formed at the lowest position of the bottom of the groove, the collection pipe of a slurry supply unit and the collection pipe of a rinsing solution supply unit are connected to the exhaust port, and the collection pipe of the rinsing solution exhaust unit is connected to a suction pump for forcedly discharging the rinsing solution by suction.

摘要翻译： 用于收集使用过的磨料浆料和冲洗溶液的每个收集槽的底部形成为字母V，在槽的底部的最下部形成排气口，浆料供应单元的收集管和收集 冲洗溶液供给单元的管道连接到排气口，并且冲洗溶液排出单元的收集管连接到用于通过抽吸强制排出冲洗溶液的抽吸泵。

公开(公告)号：US6089966A

公开(公告)日：2000-07-18

申请号：US193882

申请日：1998-11-18

申请人： Hatsuyuki Arai ,  Xu Jin Wang

发明人： Hatsuyuki Arai ,  Xu Jin Wang

IPC分类号： B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/22 ,  B24D13/12 ,  B24D13/14 ,  H01L21/302 ,  B24D17/00

CPC分类号： B24B37/22 ,  B24B37/26 ,  B24D3/22 ,  H01L21/302 ,  Y10S451/921

摘要： The present invention provides a polishing pad having a double-layer structure that allows a polishing liquid to permeate evenly throughout the pad while enabling a wafer to be evenly polished up to the neighborhood of its outer circumference.A polishing pad consists of a hard upper-layer member 11 having a lower compression rate and consisting of a material into which a polishing liquid can permeate, a soft lower-layer member 12 having a higher compression rate and consisting of a material into which a polishing liquid can permeate, and an adhesive layer 13 interposed between both members to adhere them together, wherein a plurality of narrow grooves 14 for facilitating the permeation of polishing liquid into the lower-layer member 12 and partitioning the surface of the pad into a plurality of small regions 15 that can be locally deformed are cut in the pad surface at such an interval that the maximum length of one side of the small region is 10 mm or less and that groove depth is at least half or more the thickness of the upper-layer member.

摘要翻译： 本发明提供了一种具有双层结构的抛光垫，其允许抛光液均匀地渗透整个焊盘，同时使晶片能够均匀地抛光到其外圆周附近。 抛光垫由具有较低压缩率的硬上层构件11组成，由研磨液可渗透的材料组成，具有较高压缩率的软下层构件12由以下材料组成： 抛光液可以渗透，并且粘合剂层13插入两个部件之间以将它们粘附在一起，其中多个窄槽14用于促进抛光液体渗透到下层部件12中并将焊盘的表面分隔成多个 可以局部变形的小区域15以小区域的一侧的最大长度为10mm以下并且槽深度为上部的厚度的至少一半以上的间隔在焊盘表面中切割 层成员。