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公开(公告)号：US20210319927A1
公开(公告)日：2021-10-14
申请号：US17355236
申请日：2021-06-23
发明人： Hiroya FUKUDA , Osamu Numata , Hironobu Ikeda , Toshio Nagasaka , Shinji Saiki , Hiroaki Iriyama , Masashi Uzawa , Asako Kaneko
摘要： The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.
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公开(公告)号：US12073956B2
公开(公告)日：2024-08-27
申请号：US17355236
申请日：2021-06-23
发明人： Hiroya Fukuda , Osamu Numata , Hironobu Ikeda , Toshio Nagasaka , Shinji Saiki , Hiroaki Iriyama , Masashi Uzawa , Asako Kaneko
CPC分类号： H01B1/124 , C08F20/52 , C08F26/06 , C08G73/0266 , C09D5/24 , C09D179/02 , H01B1/128 , Y10T428/24355
摘要： The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.
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公开(公告)号：US20190153626A1
公开(公告)日：2019-05-23
申请号：US16257247
申请日：2019-01-25
摘要： An object of the present invention is to provide a polyolefin fiber, particularly a core-sheath composite polypropylene fiber which is possible to be easily deformed corresponding to a stress applied from a direction perpendicular to a fiber axis, to be less fibrillated, and to have an excellent knot strength.The problem of the present invention is solved by providing the polyolefin fiber having a compressive strength of 30 to 51 MPa calculated by the following formula 1 when compressed and deformed by 30% with respect to a fiber diameter in a direction perpendicular to the fiber axis in each single fiber. St=2P/(π×L×d) (Formula 1) St: Compressive strength (MPa), P: Testing force (N) d: Single fiber diameter (mm), L: Diameter of indenter (mm)
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公开(公告)号：US10096395B2
公开(公告)日：2018-10-09
申请号：US14397957
申请日：2013-07-24
发明人： Hiroya Fukuda , Osamu Numata , Hironobu Ikeda , Toshio Nagasaka , Shinji Saiki , Hiroaki Iriyama , Masashi Uzawa , Asako Kaneko
摘要： The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.
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公开(公告)号：US11145432B2
公开(公告)日：2021-10-12
申请号：US15899532
申请日：2018-02-20
发明人： Hiroya Fukuda , Osamu Numata , Hironobu Ikeda , Toshio Nagasaka , Shinji Saiki , Hiroaki Iriyama , Masashi Uzawa , Asako Kaneko
摘要： The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.
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