公开(公告)号：US12107024B2

公开(公告)日：2024-10-01

申请号：US17682603

申请日：2022-02-28

申请人： Mitsubishi Electric Corporation

发明人： Takayuki Onaka ,  Yuki Yano

IPC分类号： H01L23/10 ,  H01L21/52 ,  H01L23/053

CPC分类号： H01L23/10 ,  H01L21/52 ,  H01L23/053

摘要： An object is to provide a technique that can suppress wet-spreading of an adhesive used to bond a case and a metal base to each other and secure the height position of the adhesive required to fill a gap created between the case and the metal base. A semiconductor device includes a metal base, an insulating substrate arranged on the metal base, a semiconductor element mounted on the insulating substrate, and a case bonded on the metal base so as to surround side surfaces of the insulating substrate and the semiconductor element, in which a pair of metal oxide films having a protruding shape is provided on a peripheral edge portion of the metal base, and the case is bonded to the metal base by an adhesive arranged in a region between the metal oxide films in the pair.