公开(公告)号：US20240355690A1

公开(公告)日：2024-10-24

申请号：US18580324

申请日：2022-07-19

Applicant: Momentive Performance Materials Inc.

Inventor： Andrea RUPPENTHAL ,  Matthias GROSSMANN ,  Umesh MISTRY ,  Karen WILKEN

IPC: H01L23/29 ,  C08J3/24 ,  C08K5/56 ,  C08L83/06

CPC classification number: H01L23/296 ,  C08J3/246 ,  C08K5/56 ,  C08L83/06 ,  C08L2203/206 ,  C08L2205/025 ,  C08L2314/08

Abstract: Provided is a composition that exhibits curing characteristics and can be cured by exposure to high energy conditions (i.e., photo-activatable) and optionally by exposure to non-photoactivatable conditions (e.g., condensation curing and/or at elevated temperatures). The present compositions are suitable for use as a potting compound in electronic applications and can be used as a material to fill space in and around electronic components. The compositions also display excellent adhesion to a variety of substrates. Also provided are methods of curing and using the compositions in various applications.