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公开(公告)号：US12095165B2
公开(公告)日：2024-09-17
申请号：US17943300
申请日：2022-09-13
申请人： Movandi Corporation
发明人： Seunghwan Yoon , Zhihui Wang , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
CPC分类号： H01Q21/065 , H01Q1/2283 , H01Q9/045 , H01Q21/0025
摘要： An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.
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公开(公告)号：US11476590B2
公开(公告)日：2022-10-18
申请号：US17060182
申请日：2020-10-01
申请人： Movandi Corporation
发明人： Seunghwan Yoon , Zhihui Wang , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
摘要： An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.
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公开(公告)号：US11855356B2
公开(公告)日：2023-12-26
申请号：US17898706
申请日：2022-08-30
申请人： Movandi Corporation
发明人： Seunghwan Yoon , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
CPC分类号： H01Q21/065 , H01Q1/2283 , H01Q9/045 , H01Q21/0025
摘要： An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.
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公开(公告)号：US20230006362A1
公开(公告)日：2023-01-05
申请号：US17943300
申请日：2022-09-13
申请人： Movandi Corporation
发明人： Seunghwan Yoon , Zhihui Wang , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
摘要： An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.
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公开(公告)号：US11509066B2
公开(公告)日：2022-11-22
申请号：US17004373
申请日：2020-08-27
申请人： Movandi Corporation
发明人： Seunghwan Yoon , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
摘要： Provided is an apparatus including a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.
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公开(公告)号：US11469521B2
公开(公告)日：2022-10-11
申请号：US17004373
申请日：2020-08-27
申请人： Movandi Corporation
发明人： Seunghwan Yoon , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
摘要： Provided is an apparatus including a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.
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公开(公告)号：US10797404B2
公开(公告)日：2020-10-06
申请号：US15607750
申请日：2017-05-30
申请人： MOVANDI CORPORATION
发明人： Seunghwan Yoon , Zhihui Wang , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
摘要： An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.
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公开(公告)号：US12095164B2
公开(公告)日：2024-09-17
申请号：US17898706
申请日：2022-08-30
申请人： Movandi Corporation
发明人： Seunghwan Yoon , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
CPC分类号： H01Q21/065 , H01Q1/2283 , H01Q9/045 , H01Q21/0025
摘要： An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.
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公开(公告)号：US11509067B2
公开(公告)日：2022-11-22
申请号：US17060182
申请日：2020-10-01
申请人： Movandi Corporation
发明人： Seunghwan Yoon , Zhihui Wang , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
摘要： An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.
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公开(公告)号：US12003029B2
公开(公告)日：2024-06-04
申请号：US17943300
申请日：2022-09-13
申请人： Movandi Corporation
发明人： Seunghwan Yoon , Zhihui Wang , Franco De Flaviis , Alfred Grau Besoli , Kartik Sridharan , Ahmadreza Rofougaran , Michael Boers , Sam Gharavi , Donghyup Shin , Farid Shirinfar , Stephen Wu , Maryam Rofougaran
CPC分类号： H01Q21/065 , H01Q1/2283 , H01Q9/045 , H01Q21/0025
摘要： An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.
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