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公开(公告)号：US20190208309A1
公开(公告)日：2019-07-04
申请号：US16237223
申请日：2018-12-31
申请人： MrSpeakers, LLC
IPC分类号： H04R1/10
摘要： An over-ear headphone system can provide optimal comfort, reliability, and fitment with a headband attached to at least one ear cup. The headband may have a first member and a second member that each extends from a rigid coupler. The rigid coupler can be configured to continuously extend about the periphery of the ear cup so that a gimbal connects the rigid coupler and the ear cup at a lateral position on the ear cup.
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公开(公告)号：US20180020292A1
公开(公告)日：2018-01-18
申请号：US15648608
申请日：2017-07-13
申请人： MrSpeakers, LLC
CPC分类号： H04R13/00 , H04R1/1008 , H04R1/2811 , H04R7/04 , H04R9/047 , H04R9/06
摘要： A planar magnetic loudspeaker may employ an airflow system having a magnet array separated from a diaphragm. The magnet array can have a plurality of airflow apertures that are arranged in a pattern and each continuously extending through a thickness of the magnet array to increase the signal-to-noise ratio of the planar magnetic loudspeaker.
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公开(公告)号：US10764672B2
公开(公告)日：2020-09-01
申请号：US16237223
申请日：2018-12-31
申请人： MrSpeakers, LLC
IPC分类号： H04R1/10
摘要： An over-ear headphone system can provide optimal comfort, reliability, and fitment with a headband attached to at least one ear cup. The headband may have a first member and a second member that each extends from a rigid coupler. The rigid coupler can be configured to continuously extend about the periphery of the ear cup so that a gimbal connects the rigid coupler and the ear cup at a lateral position on the ear cup.
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公开(公告)号：US20200252709A1
公开(公告)日：2020-08-06
申请号：US16781694
申请日：2020-02-04
申请人： MrSpeakers, LLC
IPC分类号： H04R1/10
摘要： A headphone may employ an ear pad mounted to a housing. Affixing a soft sticky or tacky non-adhesive polymer base to the underside of a headphone ear pad allows easy attachment of ear pads to a headphone with the ability to frequently and non-destructively swap pads, without the weight, bulk and fragility of other pad attachment mechanisms.
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公开(公告)号：US10178459B2
公开(公告)日：2019-01-08
申请号：US15454757
申请日：2017-03-09
申请人： MrSpeakers, LLC
摘要： A loudspeaker assembly may be configured with at least one driver disposed between first and second acoustic impedance structures. The first and second impedance structures can be arranged with one or more layers that have similar, or dissimilar, thicknesses. The first and second impedance structures can respectively be configured to maintain symmetric acoustic impedance on opposite sides of the driver during operation of the driver.
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公开(公告)号：US20170264996A1
公开(公告)日：2017-09-14
申请号：US15454757
申请日：2017-03-09
申请人： MrSpeakers, LLC
CPC分类号： H04R1/1008 , H04R3/04 , H04R9/06 , H04R19/02 , H04R29/001 , H04R29/003 , H04R31/00 , H04R2420/07
摘要： A loudspeaker assembly may be configured with at least one driver disposed between first and second acoustic impedance structures. The first and second impedance structures can be arranged with one or more layers that have similar, or dissimilar, thicknesses. The first and second impedance structures can respectively be configured to maintain symmetric acoustic impedance on opposite sides of the driver during operation of the driver.
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公开(公告)号：US11252495B2
公开(公告)日：2022-02-15
申请号：US16781694
申请日：2020-02-04
申请人： MrSpeakers, LLC
IPC分类号： H04R1/10
摘要： A headphone may employ an ear pad mounted to a housing. Affixing a soft sticky or tacky non-adhesive polymer base to the underside of a headphone ear pad allows easy attachment of ear pads to a headphone with the ability to frequently and non-destructively swap pads, without the weight, bulk and fragility of other pad attachment mechanisms.
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公开(公告)号：US20210127199A1
公开(公告)日：2021-04-29
申请号：US16666060
申请日：2019-10-28
申请人： MrSpeakers, LLC
摘要： An earphone can be configured with at least one acoustic driver positioned within an earphone housing. An acoustic driver may be acoustically coupled with an ear canal of a user via two or more airflow pathways that are configured to provide a uniform acoustic impedance from the driver to the user's ear canal.
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