公开(公告)号：US11605869B2

公开(公告)日：2023-03-14

申请号：US17158072

申请日：2021-01-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro Baba ,  Akihiro Kikuchi ,  Genro Kato ,  Kosuke Nishino ,  Nobuo Ikemoto

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/14 ,  H05K1/03 ,  H05K1/11 ,  H01P3/02

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

公开(公告)号：US10944145B2

公开(公告)日：2021-03-09

申请号：US16833711

申请日：2020-03-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro Baba ,  Akihiro Kikuchi ,  Genro Kato ,  Kosuke Nishino ,  Nobuo Ikemoto

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/14 ,  H05K1/03 ,  H05K1/11 ,  H01P3/02

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

公开(公告)号：US10424824B2

公开(公告)日：2019-09-24

申请号：US15407328

申请日：2017-01-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro Baba ,  Akihiro Kikuchi ,  Genro Kato ,  Kosuke Nishino ,  Nobuo Ikemoto

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H01P3/02

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.