公开(公告)号：US20230318160A1

公开(公告)日：2023-10-05

申请号：US18207169

申请日：2023-06-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yushi SOETA ,  Kentarou KAWABE ,  Kouki SHIMIZU ,  Toru KURISU ,  Akihiro YAMAKAWA

IPC: H01P3/08 ,  H05K1/09 ,  H05K1/05 ,  H05K3/46

CPC classification number: H01P3/088 ,  H01P3/082 ,  H05K1/09 ,  H05K1/05 ,  H05K3/4644

Abstract: A multilayer body has a structure including insulating layers stacked on each other in an up-down direction. A first conductive layer is on a top main surface of one of the insulating layers. A first signal is transmitted through the first conductive layer. A second conductive layer is on a same insulating layer that the first conductive layer is on. The second conductive layer is on a same main surface as the top main surface or the bottom main surface of the insulating layer on which the first conductive layer is located. A second signal having a higher frequency than the first signal is transmitted through the second conductive layer. A top conductive layer is above the second conductive layer. A thickness of the second conductive layer in the up-down direction is smaller than that of the first conductive layer in the up-down direction.

公开(公告)号：US20240373549A1

公开(公告)日：2024-11-07

申请号：US18773667

申请日：2024-07-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomonori KATSURA ,  Kouki SHIMIZU

IPC: H05K1/02 ,  H05K1/11

Abstract: A multilayer substrate includes a multilayer body that includes plastic resin layers and a space inside the multilayer body, a first inner layer resin in the space, and conductors that include a signal conductor and are located on the first inner layer resin, in which at least a portion of the first inner layer resin is separated from the multilayer body in the space.