公开(公告)号：US10178774B2

公开(公告)日：2019-01-08

申请号：US14068053

申请日：2013-10-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kunio Iwakoshi ,  Syuichi Onodera ,  Takao Okano ,  Yoshihito Otsubo

IPC: B32B3/30 ,  H05K3/00 ,  H01L23/498 ,  H05K3/40 ,  H01L23/15 ,  H01L21/48 ,  H05K1/11 ,  H05K3/38 ,  H05K3/46 ,  H05K3/12 ,  H05K3/24

Abstract: In an electronic component, a peripheral portion of an external terminal electrode is thicker than a center portion thereof, and at least a portion of the peripheral portion is buried in a component main body. A surface of the external terminal electrode and a principal surface of the component main body are located on the same plane. An electrically insulating coating layer is arranged along the principal surface of the component main body so as to cover at least a portion of the peripheral portion of the external terminal electrode. An end portion of the coating layer is in contact with a thickest portion of the peripheral portion of the external terminal electrode in the principal surface of the component main body. The coating layer and the surface of the external terminal electrode are located on the same plane.