公开(公告)号：US20210152192A1

公开(公告)日：2021-05-20

申请号：US17093647

申请日：2020-11-10

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Rui Tanaka

IPC: H04B1/00 ,  H04B1/04

Abstract: A radio frequency module includes: a module board including a first principal surface; a reception filter disposed on or above the first principal surface; a transmission filter disposed on the reception filter; a switch mounted on the module board; and a bonding wire that connects the transmission filter to the switch. One end of the bonding wire is connected to the transmission filter and the other end of the bonding wire is connected to the switch.

公开(公告)号：US11637576B2

公开(公告)日：2023-04-25

申请号：US17473105

申请日：2021-09-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Rui Tanaka

IPC: H04B1/16 ,  H04B1/00 ,  H04B1/12

Abstract: A radio-frequency module is able to simultaneously communicate a signal of a first communication band and a signal of a second communication band and does not simultaneously communicate a signal of the first communication band and a signal of a third communication band. The radio-frequency module includes a mounting substrate, a filter, a filter, and a filter. The filter is provided on the mounting substrate and has the first communication band as the pass band thereof. The filter is provided on the mounting substrate and has the second communication band as the pass band thereof. The filter is provided on the mounting substrate and has the third communication band as the pass band thereof. The filter and the filter are indirectly stacked on top of each other and the filter and the filter are not stacked on top of each other.

公开(公告)号：US12132507B2

公开(公告)日：2024-10-29

申请号：US17346308

申请日：2021-06-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsushi Horita ,  Yukiya Yamaguchi ,  Morio Takeuchi ,  Shigeru Tsuchida ,  Tomoaki Sato ,  Rui Tanaka

IPC: H04B1/00 ,  H03F1/02 ,  H03F3/21 ,  H03F3/24 ,  H04B1/04 ,  H04W52/52

CPC classification number: H04B1/006 ,  H03F3/245 ,  H04B1/0057 ,  H04W52/52 ,  H03F2200/294 ,  H03F2200/451

Abstract: A radio-frequency module includes a mounting substrate, a first power amplifier, a second power amplifier, a circuit component (IC chip), and an external connection terminal. The mounting substrate has a first main surface and a second main surface on opposite sides of the mounting substrate. The first power amplifier is mounted on the first main surface of the mounting substrate. The second power amplifier is mounted on the first main surface of the mounting substrate. The circuit component is mounted on the second main surface of the mounting substrate. The external connection terminal is disposed on the second main surface of the mounting substrate. The external connection terminal is connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier.

公开(公告)号：US11349507B2

公开(公告)日：2022-05-31

申请号：US17093647

申请日：2020-11-10

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Rui Tanaka

IPC: H04B1/00 ,  H04B1/04

Abstract: A radio frequency module includes: a module board including a first principal surface; a reception filter disposed on or above the first principal surface; a transmission filter disposed on the reception filter; a switch mounted on the module board; and a bonding wire that connects the transmission filter to the switch. One end of the bonding wire is connected to the transmission filter and the other end of the bonding wire is connected to the switch.