ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20180158608A1

    公开(公告)日:2018-06-07

    申请号:US15828472

    申请日:2017-12-01

    Abstract: An electronic component includes a multilayer capacitor and an interposer including a substrate main body with an electric insulation property, the multilayer capacitor being mounted on one main surface side of the substrate main body. The multilayer capacitor includes a multilayer body, a first outer electrode, and a second outer electrode. The multilayer body includes an effective region and a non-effective region surrounding the effective region. A width of the effective region is larger than a width of the substrate main body, when a width of the multilayer body is represented by W11, a thickness of the multilayer body is represented by T11, and a thickness of the substrate main body is represented by T21, a value of W11/(T11+T21) is not less than about 0.90 and not more than about 1.10.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210020378A1

    公开(公告)日:2021-01-21

    申请号:US16926923

    申请日:2020-07-13

    Abstract: In a multilayer ceramic electronic component, a stacked body includes a first outer layer and a first outermost internal electrode layer. The first outer layer defines a first main surface. The first outermost internal electrode layer is adjacent to the first outer layer. The first outermost internal electrode layer is in contact with a first external electrode at a first end surface. The thickness of the first outer layer at the first end surface is greater than the thickness of the first outer layer at the center or approximate center in a length direction.

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