公开(公告)号：US20250054698A1

公开(公告)日：2025-02-13

申请号：US18925488

申请日：2024-10-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro MISHIMA

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

Abstract: A multilayer ceramic capacitor includes first and second external electrodes. The first external electrode includes a first base electrode layer, a first electrically conductive resin layer on the first base electrode layer and including a thermosetting resin and a metal component, and a first Ni plated layer on the first electrically conductive resin layer. The second external electrode includes a second base electrode layer, a second electrically conductive resin layer on the second base electrode layer and including a thermosetting resin and a metal component, and a second Ni plated layer on the second electrically conductive resin layer. Tensile stress is provided as internal stress inside the first and second Ni plated layers.

公开(公告)号：US20230126382A1

公开(公告)日：2023-04-27

申请号：US17967929

申请日：2022-10-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shima KATSUBE ,  Yasuhiro MISHIMA ,  Yoshiyuki NOMURA ,  Kazuki YOSHINO

IPC: H01G4/232 ,  H01G4/30

Abstract: A multilayer ceramic capacitor includes a multilayer body including ceramic layers and internal electrode layers laminated therein, a pair of external electrodes electrically connected to the internal electrode layers and provided on two end surfaces of the multilayer body. The pair of external electrodes each include a base electrode layer including a metal component, an electrically conductive resin layer on the base electrode layer and including a thermosetting resin and a metal component, and a Ni-plated layer on the electrically conductive layer. A stress of about −150 MPa or more and about 50 MPa or less is applied to the Ni-plated layer, and an end portion of the Ni-plated layer being in contact with the multilayer body.

公开(公告)号：US20240249889A1

公开(公告)日：2024-07-25

申请号：US18619245

申请日：2024-03-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro MISHIMA

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227

Abstract: A multilayer ceramic capacitor includes a multilayer body including ceramic layers and internal electrode layers, and external electrodes at both end surfaces of the multilayer body and each including a base electrode layer, a conductive resin layer on the base electrode layer, and a plated layer. The conductive resin layer includes an end-surface-side conductive resin layer portion on both end surfaces, and an adjacent conductive resin layer portion extending from an end portion of the end-surface-side conductive resin layer portion to be located on both main surfaces and both lateral surfaces. A content ratio of a resin component included in the adjacent conductive resin layer portion is greater than a content ratio of a resin component included in the end-surface-side conductive resin layer portion, and the content ratio of the resin component in the end-surface-side conductive resin layer portion is at least about 10% and no more than about 60%.

公开(公告)号：US20210098193A1

公开(公告)日：2021-04-01

申请号：US16995856

申请日：2020-08-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro MISHIMA

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G2/06

Abstract: A multilayer ceramic electronic component includes a stacked body and external electrodes provided on two end surfaces of the stacked body. Each external electrode includes an underlying electrode layer including a conductive metal, a resin electrode layer including a resin and metal component, a resin layer including a resin and no metal component, and a metal layer. The underlying electrode layers extend from the two end surfaces to cover a portion of two main surfaces and two lateral surfaces. The resin electrode layers cover the underlying electrode layers provided on the two end surfaces. The resin layers are connected to the resin electrode layers and provided on the underlying electrode layers located on a portion of the two main surfaces and two lateral surfaces. The metal layers cover the surfaces of the resin electrode layers and resin layers.