MULTILAYER CIRCUIT BOARD HAVING SIGNAL AND POWER ISOLATION CIRCUIT

    公开(公告)号:US20230276567A1

    公开(公告)日:2023-08-31

    申请号:US18311130

    申请日:2023-05-02

    CPC classification number: H05K1/0218 H05K1/181 H05K2201/1003

    Abstract: A multilayer circuit board having a signal and power isolation circuit, which can suppress the capacitive coupling between a chip inductor and a ground layer below the chip inductor and also suppress the characteristic impedance change occurring in a mounting pad on a microstrip line. Portions of the inner-layer ground below both the mounting pad on the microstrip line and the chip inductors connected to the mounting pad are separately removed respectively as the signal transmission characteristic compensation removal portion, which is formed by removing a portion having a predetermined area and situated immediately below the mounting pad, and the inductor characteristic compensation removal portion, which is formed by removing a mounting-surface-below portion having a predetermined area and situated immediately below the chip inductors. The signal transmission characteristic compensation removal portion and the inductor characteristic compensation removal portion are electrically isolated from each other with the predetermined distance therebetween.

    ELECTRONIC CIRCUIT
    3.
    发明申请

    公开(公告)号:US20220359116A1

    公开(公告)日:2022-11-10

    申请号:US17848683

    申请日:2022-06-24

    Abstract: An electronic circuit includes a shield line including first and second signal lines and a shield. The first and second signal lines are connected to a signal source, and the shield coating is around the first and second signal lines. The electronic circuit further includes a signal ground near the signal source; a frame ground that is isolated from the signal ground and connected to the shield; a common mode choke coil that includes first, second and third coils magnetically coupled to one another; and a capacitor that is connected in parallel with the third coil. The first coil is connected in series between the signal source and the first signal line. The second coil is connected in series between the signal source and the second signal line. The third coil and the capacitor that are connected in parallel are connected between the signal ground and the frame ground.

    CIRCUIT MODULE, NETWORK MODULE, AND IN-VEHICLE ELECTRONIC DEVICE

    公开(公告)号:US20190386630A1

    公开(公告)日:2019-12-19

    申请号:US16556142

    申请日:2019-08-29

    Abstract: A circuit module includes a wiring board on which are provided a ground plane, a signal line, and a conductive pattern for connection to an outer conductor of a coaxial cable including an inner conductor and the outer conductor. A common-mode choke coil is mounted on the wiring board such that one of coils of the common-mode choke coil connects the ground plane and the conductive pattern and that the other coil is inserted in the signal line. A communication element is mounted on the wiring board and includes a first signal terminal and a second signal terminal. The first signal terminal is connected to the common-mode choke coil via the signal line, and the second signal terminal is connected to the ground plane. A first capacitor is inserted in series in the signal line between the common-mode choke coil and the first signal terminal.

    NOISE FILTER IMPLEMENTATION STRUCTURE
    6.
    发明申请
    NOISE FILTER IMPLEMENTATION STRUCTURE 审中-公开
    噪声滤波器实现结构

    公开(公告)号:US20170026018A1

    公开(公告)日:2017-01-26

    申请号:US15213857

    申请日:2016-07-19

    CPC classification number: H01F27/402 H01F27/29 H01F2017/0093 H03H7/427

    Abstract: A transmission line includes three wires formed on a substrate. Each of the transmission lines transmits a three-level signal. A common-mode choke coil is inserted into the transmission line. The common-mode choke coil includes three coils coupled to one another and three pairs of outer electrodes, each of the three pairs being connected to the corresponding two ends of the coils. The outer electrodes of the common-mode choke coil are connected to the transmission line such that the three coils are serially inserted into the respective three wires.

    Abstract translation: 传输线包括形成在基板上的三根线。 每个传输线传输三电平信号。 共模扼流线圈插入传输线。 共模扼流线圈包括彼此耦合的三个线圈和三对外部电极,三对中的每一对连接到线圈的对应的两端。 共模扼流线圈的外部电极连接到传输线,使得三个线圈串联插入相应的三根线中。

    CIRCUIT MODULE
    7.
    发明公开
    CIRCUIT MODULE 审中-公开

    公开(公告)号:US20230292430A1

    公开(公告)日:2023-09-14

    申请号:US18179955

    申请日:2023-03-07

    CPC classification number: H05K1/0233 H05K5/02 H05K2201/1003 H04B3/548

    Abstract: A circuit module includes a wiring board, first and second lines, a first inductor, and a sheet-like first conductor. The first line is on the wiring board, for transmitting a signal to a first circuit, outside the wiring board, and a power supply voltage for supplying power to the first circuit. The second line is on the wiring board side by side with the first line, for transmitting a signal to a second circuit and a power supply voltage for supplying power to the second circuit, which is outside the wiring board independently of the first circuit. The first inductor is on the wiring board, having one end connected to the first line, and another end connected to a power supply circuit for supplying the power. The sheet-like first conductor is on or near at least part of a side surface of a housing that holds the first inductor.

    TRANSMISSION SYSTEM
    8.
    发明公开
    TRANSMISSION SYSTEM 审中-公开

    公开(公告)号:US20230198574A1

    公开(公告)日:2023-06-22

    申请号:US18169736

    申请日:2023-02-15

    CPC classification number: H04B3/56 H01B11/12

    Abstract: A transmission system capable of improving transmission characteristics in a low frequency range and having reduced size. A transmission system for superimposing power on a signal transmission path between a first circuit module and a second circuit module includes a first capacitor between the transmission path and a first interface IC in the first circuit module, a second capacitor between the transmission path and a second interface IC in the second circuit module, a first inductor between a first power supply circuit in the first circuit module and the transmission path, and a second inductor between a second power supply circuit in the second circuit module and the transmission path. A capacitance value of the first capacitor and a capacitance value of the second capacitor differ from each other. Inductance values of each of the first and second inductors are in a range from 20 [μH] to 50 [μH].

    WIRELESS CIRCUIT-MOUNTED ELECTRONIC APPARATUS

    公开(公告)号:US20180145716A1

    公开(公告)日:2018-05-24

    申请号:US15788840

    申请日:2017-10-20

    CPC classification number: H04B1/40 H03H7/06 H04B15/04

    Abstract: A signal transmission and reception element transmits and receives a differential signal. Two transmission lines transmit the differential signal between the signal transmission and reception element and a connector. The signal transmission and reception element is connected to an external apparatus with the connector interposed therebetween. A noise generation source generates noise in a wireless band, which is coupled to the transmission lines. An antenna has a gain in a frequency band of the noise which is generated in the noise generation source. A wireless signal processing circuit processes a signal received by the antenna. An absorption-type filter that is mounted on the transmission lines absorbs noise mixed in the transmission lines.

    MOUNTING STRUCTURE FOR INDUCTORS
    10.
    发明申请

    公开(公告)号:US20230097690A1

    公开(公告)日:2023-03-30

    申请号:US18056187

    申请日:2022-11-16

    Abstract: A mounting structure for mounting inductors to suppress cross talk and a stub effect due to a mounting land, and reduce deterioration of signal transmission characteristics. A first Bias-T inductor is mounted on a circuit board with one electrode terminal connected to a first mounting land with an axial direction of the first Bias-T inductor oriented perpendicular to the first mounting land and the one electrode terminal extends along the first mounting land. A second Bias-T inductor is mounted on the circuit board in the vicinity of the first Bias-T inductor with one electrode terminal connected to a second mounting land with an axial direction of the second Bias-T inductor inclined by 90° with respect to the axial direction of the first Bias-T inductor and the second Bias-T inductor is oriented perpendicular to the second mounting land and the one electrode terminal extends along the second mounting land.

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