公开(公告)号：US10861647B2

公开(公告)日：2020-12-08

申请号：US15902188

申请日：2018-02-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuya Takagi ,  Akira Fujita ,  Hideaki Tanaka ,  Togo Matsui

IPC: H01G4/012 ,  H01G4/30 ,  H01G4/224 ,  H01G4/12 ,  H01G4/248 ,  H01G4/232

Abstract: A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.

公开(公告)号：US11011308B2

公开(公告)日：2021-05-18

申请号：US16654054

申请日：2019-10-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuya Takagi

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer ceramic electronic component includes a laminated body, and first and second external electrodes respectively provided on first and second end surfaces of the laminated body. The laminated body includes an inner layer portion in which the first and second internal electrode layers oppose each other with the dielectric ceramic layers interposed therebetween, and outer layer portions sandwiching the inner layer portion in the lamination direction and a side margin portion sandwiching the inner layer portion and the outer layer portions in the width direction. The side margin portion is defined by ceramic layers laminated in the width direction, and includes, as the ceramic layers, an inner layer on an innermost side of the laminated body and an outer layer on an outermost side of the laminated body.

公开(公告)号：US10650973B2

公开(公告)日：2020-05-12

申请号：US15158691

申请日：2016-05-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuya Takagi ,  Togo Matsui ,  Hikaru Okuda

IPC: H01G7/00 ,  H01G4/30 ,  H01G4/12 ,  H01L41/273

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.