Phase-change random access memory device and method of manufacturing the same
    1.
    发明授权
    Phase-change random access memory device and method of manufacturing the same 有权
    相变随机存取存储器件及其制造方法

    公开(公告)号:US08592796B2

    公开(公告)日:2013-11-26

    申请号:US13326490

    申请日:2011-12-15

    IPC分类号: H01L47/00

    摘要: A phase-change random access memory device includes a semiconductor substrate, an interlayer dielectric layer formed over the semiconductor substrate and having contact holes defined therein, metal contacts formed in the contact holes, an ohmic contact layer formed over the metal contacts and having recesses defined therein, and switching elements formed over the recesses of the ohmic contact layer.

    摘要翻译: 相变随机存取存储器件包括半导体衬底,形成在半导体衬底上并具有限定在其中的接触孔的层间绝缘层,形成在接触孔中的金属触点,形成在金属触点上并具有凹陷的欧姆接触层 以及形成在欧姆接触层的凹部上方的开关元件。