-
公开(公告)号：US20220151113A1
公开(公告)日：2022-05-12
申请号：US17440315
申请日：2020-02-14
Applicant: NEC Corporation
Inventor： Mahiro HACHIYA , Minoru YOSHIKAWA , Takashi OHTSUKA , Nobuo KANEKO
Abstract: To efficiently cool down heat of a heating element 20, this electronic device 100 is provided with a circuit board 10 having a heating element 20 that is attached to a first main surface 11 thereof, a case 30 having an opening part 31 that is formed in a surface facing the heating element 20 and housing a refrigerant COO therein, and a connection part 40 connecting the opening part 31 and the heating element 20 so as to enclose the refrigerant COO, the connecting part has a thickness of at most 0.21 mm.
Search Results
1
records
(took 0.01 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
