公开(公告)号：US20250022742A1

公开(公告)日：2025-01-16

申请号：US18895769

申请日：2024-09-25

Applicant: NGK INSULATORS, LTD.

Inventor： Yoshio KIKUCHI ,  Sugio MIYAZAWA ,  Masaru NOMURA ,  Daisuke YABU

IPC: H01L21/683 ,  H01L21/56

Abstract: A temporary fixation substrate having one main surface to which a plurality of electronic components adhere and are temporarily fixed by a resin mold has a chamfered region at an end over an entire circumference of each of the one main surface and the other main surface, and an arithmetic average roughness of the chamfered region at least on a side of the one main surface is 0.1 μm to 10 μm and is greater than an arithmetic average roughness of the one main surface.