HEAT DISSIPATION MEMBER
    3.
    发明申请

    公开(公告)号:US20210341234A1

    公开(公告)日:2021-11-04

    申请号:US17305409

    申请日:2021-07-07

    Abstract: A heat dissipation member dissipates heat generated at a heat source. The heat dissipation member may include a substrate having a porosity ratio of 5 volume % or less; and an inorganic porous layer disposed on a surface of the substrate, wherein the inorganic porous layer may have a porosity ratio ranging from 25 volume % or more to 85 volume % or less and have lower thermal conductivity than the substrate. In this heat dissipation member, 15 mass % or more of constituents of the inorganic porous layer may be alumina.

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