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公开(公告)号：US20200275554A1
公开(公告)日：2020-08-27
申请号：US16782191
申请日：2020-02-05
Applicant: NHK Spring Co., Ltd.
Inventor： Tomohiro KAWARABAYASHI
IPC: H05K3/00
Abstract: A method for producing a circuit board includes a first step of arranging a circuit alignment jig having a pierced portion for receiving a circuit conductor corresponding to a circuit pattern on an insulating layer formed on a metal substrate, a second step is inserting the circuit conductor into the pierced portion, and a third step is pressing the circuit conductor to the insulating layer together with the circuit alignment jig.
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