BONDING JIG AND BONDING METHOD
    1.
    发明申请

    公开(公告)号:US20250065575A1

    公开(公告)日:2025-02-27

    申请号:US18724213

    申请日:2022-12-28

    Abstract: A bonding jig for crimping and bonding first and second members constituting a damping member to a bonded member includes: a first bonding member configured to hold the first member; a second bonding member configured to hold the second member and cover the first bonding member to crimp the first and second members onto the bonded member; and a switching mechanism configured to switch, in a space where the first bonding member holds the first member, between a first state in which a gap is formed between the first bonding member and a part of a side surface of the first member continuous with a crimping surface with the second member and a second state in which the gap is filled to control a position of the first member.

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