公开(公告)号：US10147856B2

公开(公告)日：2018-12-04

申请号：US14944230

申请日：2015-11-18

Applicant: NICHIA CORPORATION

Inventor： Motohisa Nogi ,  Saiki Yamamoto

IPC: H01L33/62 ,  H01L33/48

Abstract: A composite substrate includes a plate-like lead frame having a plurality of supporting leads and a plurality of element containers supported by the supporting leads. The plurality of element containers each has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead, and within the resin molded body, the first electrode lead, the second electrode lead, and the supporting lead are held spaced apart from one another. At least one of the plurality of element containers has a wire that connects the first electrode lead and the supporting lead and is covered with the resin molded body.

公开(公告)号：US10475977B2

公开(公告)日：2019-11-12

申请号：US16177330

申请日：2018-10-31

Applicant: NICHIA CORPORATION

Inventor： Motohisa Nogi ,  Saiki Yamamoto

IPC: H01L33/62 ,  H01L33/48

Abstract: A light emitting device includes an element container and a light emitting element. The element container has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead and includes an indentation at an outer surface, a wire covered with the resin molded body and extending from the first electrode lead to the indentation. The light emitting element is housed in the element container and electrically connected to the first electrode lead and the second electrode lead.