公开(公告)号：US20210159380A1

公开(公告)日：2021-05-27

申请号：US17170519

申请日：2021-02-08

Applicant: NICHIA CORPORATION

Inventor： Yuta HORIKAWA ,  Takuya MIKI ,  Shoichi ISHIKAWA ,  Ryosuke WAKAKI

IPC: H01L33/62 ,  H01L33/48 ,  H01L25/075

Abstract: A light-emitting device includes: a resin package; and a first light-emitting element and a second light-emitting element. The resin package includes: a resin portion; a first lead having an upper surface and an end surface; a second lead having an upper surface and an end surface; and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. The first light-emitting element and the second light-emitting element are disposed in the recess. The first lead and the second lead are arranged in a first direction. The first light-emitting element and the second light-emitting element are arranged in a second direction perpendicular to the first direction.

公开(公告)号：US20200161523A1

公开(公告)日：2020-05-21

申请号：US16773434

申请日：2020-01-27

Applicant: NICHIA CORPORATION

Inventor： Yuta HORIKAWA ,  Takuya MIKI ,  Shoichi ISHIKAWA ,  Ryosuke WAKAKI

IPC: H01L33/62 ,  H01L33/48 ,  H01L25/075

Abstract: A light-emitting device includes: a resin package including: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion; and a first light-emitting element and a second light-emitting element that are disposed in the recess.

公开(公告)号：US20190165233A1

公开(公告)日：2019-05-30

申请号：US16198154

申请日：2018-11-21

Applicant: NICHIA CORPORATION

Inventor： Yuta HORIKAWA ,  Takuya MIKI ,  Shoichi ISHIKAWA ,  Ryosuke WAKAKI

IPC: H01L33/62 ,  H01L33/48

Abstract: A resin package includes: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. In a top view, the upper surface of the first lead includes a first groove overlapping a first side of the bottom surface, a second groove overlapping a second side of the bottom surface, a third groove overlapping a third side of the bottom surface, and one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead.