METHOD OF PREPARING BONDED MAGNET AND BONDED MAGNET

    公开(公告)号:US20200211742A1

    公开(公告)日:2020-07-02

    申请号:US16728320

    申请日:2019-12-27

    Abstract: The present disclosure aims to provide a bonded magnet having good magnetic properties and a method of preparing the bonded magnet. The present disclosure provides a method of preparing a bonded magnet, including: a first compression step of compressing a magnetic powder having an average particle size of 10 μm or less while magnetically orienting it to obtain a first molded article; a second compression step of bringing the first molded article into contact with a thermosetting resin having a viscosity of 200 mPa·s or less, followed by compression to obtain a second molded article; and a heat treatment step of heat treating the second molded article.

    METHOD OF PRODUCING MAGNETIC POWDER-CONTAINING RESIN COMPOSITION

    公开(公告)号:US20230374257A1

    公开(公告)日:2023-11-23

    申请号:US18318924

    申请日:2023-05-17

    Abstract: A method, including: preparing at least one magnetic powder having an average particle size that is at least 1 μm but not more than 10 μm, at least one thermosetting resin, and at least one curing agent, wherein at least one of the thermosetting resin and the curing agent includes at least one monomer having a melting point that is higher than 70° C. but not higher than 140° C., and wherein an amount of the monomer having the melting point that is higher than 70° C. but not higher than 140° C. is at least 33% by volume but not more than 100% by volume of a combined amount of the thermosetting resin and the curing agent; and obtaining a magnetic powder-containing resin composition by kneading the magnetic powder, the thermosetting resin, and the curing agent at a temperature of higher than 70° C. but not higher than 140° C. and then lowering the temperature.

    BONDED MAGNET
    4.
    发明公开
    BONDED MAGNET 审中-公开

    公开(公告)号:US20230360827A1

    公开(公告)日:2023-11-09

    申请号:US18318290

    申请日:2023-05-16

    CPC classification number: H01F1/059 H01F1/0558 H01F1/20

    Abstract: The present disclosure aims to provide a bonded magnet having good magnetic properties and a method of preparing the bonded magnet. The present disclosure provides a method of preparing a bonded magnet, including: a first compression step of compressing a magnetic powder having an average particle size of 10 µm or less while magnetically orienting it to obtain a first molded article; a second compression step of bringing the first molded article into contact with a thermosetting resin having a viscosity of 200 mPa·s or less, followed by compression to obtain a second molded article; and a heat treatment step of heat treating the second molded article.

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