公开(公告)号：US11694826B2

公开(公告)日：2023-07-04

申请号：US16728320

申请日：2019-12-27

Applicant: NICHIA CORPORATION

Inventor： Takashi Asada ,  Shuichi Tada

IPC: H01F1/059 ,  H01F1/055 ,  H01F1/20

CPC classification number: H01F1/059 ,  H01F1/0558 ,  H01F1/20

Abstract: The present disclosure aims to provide a bonded magnet having good magnetic properties and a method of preparing the bonded magnet. The present disclosure provides a method of preparing a bonded magnet, including: a first compression step of compressing a magnetic powder having an average particle size of 10 μm or less while magnetically orienting it to obtain a first molded article; a second compression step of bringing the first molded article into contact with a thermosetting resin having a viscosity of 200 mPa·s or less, followed by compression to obtain a second molded article; and a heat treatment step of heat treating the second molded article.