公开(公告)号：US11219123B2

公开(公告)日：2022-01-04

申请号：US17173102

申请日：2021-02-10

申请人： NIPPON MEKTRON, LTD.

发明人： Fumihiko Matsuda ,  Yoshihiko Narisawa ,  Kenji Kumagai ,  Daisuke Shiokawa ,  Yuki Ogi ,  Akihiko Toyoshima ,  Masami Uchino ,  Isao Arase ,  Hiroshi Takeuchi

IPC分类号： H05K1/02 ,  H05K1/03

摘要： Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.