公开(公告)号：US20230159321A1

公开(公告)日：2023-05-25

申请号：US17801070

申请日：2021-08-05

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroki KIGAMI ,  Kenji ONISHI

IPC: B81B7/00 ,  C09J7/35 ,  C09J133/08

CPC classification number: B81B7/0029 ,  C09J7/35 ,  C09J133/08 ,  C09J2203/326 ,  C09J2301/304 ,  C09J2301/312

Abstract: A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×105 Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.