公开(公告)号：US11765831B1

公开(公告)日：2023-09-19

申请号：US18120638

申请日：2023-03-13

Applicant: NOKIA SOLUTIONS AND NETWORKS OY

Inventor： Darrell Barabash ,  Abhijit Ghose ,  Joseph Smetana

IPC: H01C7/06 ,  H01C7/13 ,  H05K1/16 ,  H01C7/00

CPC classification number: H05K1/167 ,  H01C7/006

Abstract: According to an aspect, there is provided a printed circuit board-based resistive device. The resistive device comprises, arranged on a substrate of the printed circuit board of the printed circuit board: a first conductive pad; a second conductive pad; a resistive patch having a first longitudinal end connected to the first conductive pad and a second longitudinal end connected to the second conductive pad, wherein a width of the resistive patch varies along a length of the resistive patch and has a maximum at a point between the first and second longitudinal ends.