公开(公告)号：US12057355B2

公开(公告)日：2024-08-06

申请号：US17607044

申请日：2020-04-28

Applicant: NOVA LTD

Inventor： Michael Shifrin ,  Avron Ger

IPC: G06F30/367 ,  G06F30/398 ,  H01L21/66 ,  G06F119/18

CPC classification number: H01L22/24 ,  G06F30/367 ,  G06F30/398 ,  G06F2119/18

Abstract: Controlling semiconductor device manufacture by acquiring training scatterometric signatures collected at training locations on training semiconductor wafers and corresponding to locations within a predefined design of a training semiconductor device, the training signatures collected after predefined processing steps during manufacture of the device on the training wafers, acquiring manufacturing outcome data associated with the training locations, training a prediction model using the training signatures and the manufacturing outcome data, and applying the prediction model to a candidate scatterometric signature to predict a manufacturing outcome, the candidate signature collected at a candidate location on a candidate semiconductor wafer, the candidate location corresponding to a location within the same predefined design of a candidate semiconductor device, the candidate signature collected after any of the processing steps during manufacture of the candidate device on the candidate wafer.