公开(公告)号：US20150022744A1

公开(公告)日：2015-01-22

申请号：US14511062

申请日：2014-10-09

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： Jiun-Jie TSAI ,  Ching-Chun LIN ,  Tsen-Wei CHANG ,  Yu-Tsung LU ,  Tzu-Jen LO ,  Hao-Jan HUANG ,  Wing-Kai TANG

IPC: H05K1/18 ,  G06F3/041 ,  H05K1/02

CPC classification number: H05K1/189 ,  G06F1/1626 ,  G06F1/184 ,  G06F1/185 ,  G06F3/041 ,  G06F3/0412 ,  G06F2203/04102 ,  H05K1/028 ,  H05K1/147 ,  H05K2201/052 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10166

Abstract: A single flexible printed circuit (FPC) board for connecting multiple modules including a thin film is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. The first module connecting portion is located on a first side of the thin film. The second module connecting portion and the third module connecting portion are located on a second side of the thin film. The first side is opposite to the second side. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion.

Abstract translation: 提供了用于连接包括薄膜的多个模块的单个柔性印刷电路（FPC）板。 薄膜具有第一模块连接部分，第二模块连接部分和第三模块连接部分。 第一模块连接部分位于薄膜的第一侧上。 第二模块连接部分和第三模块连接部分位于薄膜的第二侧上。 第一面与第二面相反。 至少一条第一线路设置在第一模块连接部分和第二模块连接部分之间。 至少一条第二线路设置在第一模块连接部分和第三模块连接部分之间。